Product Development Engineer - 106402

This AMD design team is responsible for the thermal, mechanical and acoustic design of graphics cards, including the AMD Radeonâ„¢ and AMD Radeon Proâ„¢ line of desktop and workstation cards. This team is essential to the success of AMD as a growing company! It is a high impact global team, and there are plenty of opportunities to make significant contributions that will impact the end product. You will be working on some of the most exciting projects the industry has to offer!

The Role:

As a member of the design team, you will be responsible for end-to-end development and delivery of commercially-viable discrete GPU thermal/mechanical solutions to the marketplace in a timely and cost-effective manner.

The Person:

Communication, teamwork, and problem solving! We are seeking someone with excellent verbal and written communication skills at the engineering and executive levels, including a proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion.  This role requires considerable use of initiative and independent judgment – all within a tight framework of a highly-coordinated and uniformly-executing global team.

Key Responsibilities: 

In this role, you will focus on multiple areas including:

• Product scoping and definition of silicon-level thermal sensing, control features, architecture, and thermal solution feasibility analysis, including cost analysis for volume manufacturing. Understand both customer and system design requirements and break these down into thermal solution level requirements and deliverables.
• Product Design of graphics card thermal solutions, including CFD simulations, FEA, and CAD designs to meet or exceed the product requirements and schedule with an eye towards industrial design while being mindful of cost optimizations.
• Characterization of gaming and workstation products through prototyping, testing, and analysis. This includes creating test plans for thermal, mechanical, and acoustic tests; data analysis; debug; and optimization at a card-level and customer/reference system-level.
• Technology development from the chip-level to the system-level; constantly driving innovation and pushing the boundaries of electronics cooling and productize leading-edge technology for volume manufacturing.

Preferred Experience: 

• CFD: Experience with Icepak and/or Flotherm is required.

• CAD: Experience with SolidWorks and/or Creo is a plus.

• FEA: FEA experience is a plus, preferably using ANSYS.

• Lab Skills: Experience with Design of Experiments, instrumentation, data acquisition and analysis, including uncertainty analysis.
• Manufacturing: Good knowledge of DFM (Design for Manufacturing), including experience with volume manufacturing in Asia as well as North America.
• Data analysis: the ability to work with and analyze large sets of data to extract useful conclusions.
• Experience working with Power BI, Tableau, and SQL databases to build reports.
• Experience in scripting/programming languages, especially Ruby and Python.
• Test Automation: the ability to review equipment documentation and generate tools that automate their operation.

Academic Credentials: 

• Bachelor, Masters or PhD degree in Thermal/Mechanical Engineering or related area
• Previous relevant experience in an electronics-cooling related Thermal/Mechanical Engineering