Role

The Packaging Signal Integrity/Power Integrity engineering team ensures that the electrical performance requirements of the silicon and the cost requirements of the product are met through the integration of silicon, package and platform electrical design. Packaging Signal Integrity/Power Integrity team also provides design support to engineering design teams for both current and forward looking product development and feasibility studies.

You Will

• Focus on the electrical design, modeling, simulation and characterization of high-speed signal propagation and power delivery networks in AMD products. You will work in close collaboration with AMD coworkers and customers to ensure optimal engineering design decisions and efficient problem solving, including:
• Using simulations to ensure packaging and PCB\'s are designed well and meet required speeds.
• Review layouts to determine any areas that require additional refinement.
• Extract models for package, PCB and Sockets from vendors, collecting standardized models if available, and running through simulation.
• Run channel simulations to generate performance numbers; evaluating those numbers against the spec.

Skills and Experience

• Knowledge of SI/PI fundamentals and hands-on experience in modeling complex structures such as packages, PCB boards.
• Experience with PCB, Package and IC level power delivery networks
• Experience in silicon packaging and PCB design for signal and power integrity
• Experience with high-speed digital signaling interfaces such as PCIe, G/LP/DDRx, HDMI, USB and etc.
• Expertise in electrical modeling EDA and AMS tools such as HFSS, SIwave, HSPICE
• Knowledge of electromagnetic theory and circuit analysis
• Basic knowledge in Python, Matlab or other engineering computing languages
• Ability to effectively communicate ideas and results
• Ability to collaborate and work harmoniously with others
• Ability to work independently

Academic Credentials

Bachelor’s in Electrical Engineering, Computer Science and Engineering or equivalent